http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201330333-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c0444efde206a2f829562761e58b7e1e |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-098 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 |
| filingDate | 2012-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2d50c121208be762643a83eed01f2c4 |
| publicationDate | 2013-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201330333-A |
| titleOfInvention | Resin composition for optical semiconductor encapsulation and optical semiconductor device using same |
| abstract | An object of the present invention is to provide a resin composition for optical semiconductor encapsulation, which is capable of obtaining a cured product having excellent transparency, heat resistance, light resistance and crack resistance, and an optical semiconductor device using the cured product as a package material. It can provide excellent electrical conduction characteristics and resistance to thermal shock. The resin composition for optical semiconductor encapsulation of the present invention is an optical semiconductor package containing an alicyclic epoxy compound (A), an alicyclic polyester resin (B), a curing agent (C), and a curing accelerator (D). The resin composition characterized in that the alicyclic epoxy compound (A) is at least one selected from the group consisting of (A1) a compound represented by the following formula (I) and (A2) an alicyclic ring directly epoxy. a compound having a group-bonded bond and (A3) a compound of a group of three or more epoxy groups constituting two carbon atoms and an oxygen atom adjacent to the alicyclic ring, for use in optical semiconductor packaging The total amount (100% by weight) of the epoxy group-containing compound contained in the resin composition, the total content of the above alicyclic epoxy compound (A) is 55 to 100% by weight, and the above alicyclic polyester resin (B) The alicyclic polyester having an alicyclic structure in the main chain, the curing agent (C) being an acid anhydride curing agent, and the curing accelerator (D) containing an organic carboxylic acid zinc. □ |
| priorityDate | 2011-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 172.