http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201330210-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0aa485d286850898ac84bdb906bc1a41 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1632 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6723 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 |
| filingDate | 2012-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4120e45292eed777fad2ca561210abc6 |
| publicationDate | 2013-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201330210-A |
| titleOfInvention | A machine suitable for metallizing a semiconductor or conductive substrate cavity such as a through-hole via structure |
| abstract | The present invention relates to a machine suitable for metallizing a semiconductor or conductive substrate cavity such as a through-hole via structure, according to a metallization process comprising the steps of: a) depositing an insulating dielectric in the cavity a layer, b) depositing a barrier layer for diffusion of the filled metal, c) filling the cavity by electrodepositing a metal, preferably copper, and d) completing annealing of the substrate, the machine Characterized in that it comprises a series of wet processing modules assembled to perform the steps a), b) and c) wet processing in a chemical bath, and at least one additional module suitable for implementing the base The annealing step d) of the material, so that the machine can complete the entire metallization process of the cavity. |
| priorityDate | 2011-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.