| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81193
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73104
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-14181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31938 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D133-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J165-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2012-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d558f51235128c0066525fc05b80de3d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_334f81717612b72a029585c5e5a9896e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf45fbf2f608c17700db1e7c0fc15f4c |
| publicationDate |
2013-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201329145-A |
| titleOfInvention |
Underlayer filling material and method of manufacturing semiconductor device |
| abstract |
The present invention provides a method of manufacturing a semiconductor device using a semiconductor device by using a material which can be used to reduce the difference in thermal response behavior of a semiconductor element and an adherend, thereby ensuring a usable material, and capable of manufacturing a semiconductor device having high connection reliability. The storage elastic modulus E' [MPa] and the thermal expansion coefficient α [ppm/K] of the underfill material of the present invention after heat curing at 175 ° C for one hour satisfy the following formula (1) at 25 ° C. E'×α<250000[Pa/K]‧‧‧(1) |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I804856-B |
| priorityDate |
2011-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |