abstract |
The present invention provides a resin composition for a prepreg of a cured product which is excellent in solubility in a solvent and which is excellent in flame resistance and has a low water absorption rate, and provides a prepreg and a laminate using the composition. And printed circuit boards, etc. The resin composition for a prepreg according to the present invention comprises at least a cyanate compound (A), an epoxy resin (B), and an inorganic filler obtained by cyanating a phenol-modified xylene formaldehyde resin. |