| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e7d076bc41e405e5681921c306ddb214 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 |
| filingDate |
2012-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_059983e5e346898610138c76868ec198 |
| publicationDate |
2013-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201327738-A |
| titleOfInvention |
Semiconductor hermetic package structure and manufacturing method thereof |
| abstract |
The present invention discloses a semiconductor package structure and a method of fabricating the same, comprising: a substrate, a first conductor layer, a semiconductor component, a second conductor layer, and an upper cover. The substrate has a first surface and a second surface; the first conductor layer is disposed on the first surface of the substrate; the semiconductor component is electrically connected to the first conductor layer; and the second conductor layer is disposed on the substrate a first surface surrounding the conductor element and the first conductor layer, and the second conductor layer is higher in height than the first conductor layer; the upper cover is adhered to the upper end of the second conductor layer to seal the semiconductor component. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I726102-B |
| priorityDate |
2011-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |