Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_399d433982220f3203f7f18db8c9aa28 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1305 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2237-121 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B37-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4871 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-286 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B37-021 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-28 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15 |
filingDate |
2012-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_015c9e4ffbdb1fee775b592536370fe0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef7f50a0f95668804d14cee62296fced |
publicationDate |
2013-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201324701-A |
titleOfInvention |
Joint body |
abstract |
The present invention provides a bonded body having high joint strength and excellent heat dissipation properties and heat resistance. The present invention includes a semiconductor element 30 and a ceramic substrate 10 having an insulating layer formed with a circuit layer 20 on which the semiconductor element 30 is mounted; the semiconductor element 30 and the circuit layer 20 are made of aluminum as a main component and contain At least one of the aluminum-based hard solders 60 selected from the group consisting of magnesium, bismuth and copper is brazed in a vacuum or in an inert gas atmosphere. |
priorityDate |
2011-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |