| abstract |
An object of the present invention is to provide a polishing pad of a CMP method which is excellent in polishing properties (high polishing rate, scratch-free property, and flatness). The present invention relates to a urethane resin composition for a polishing pad comprising a main component containing a urethane prepolymer (A) having an isocyanate group, and a compound having a functional group reactive with an isocyanate group. The hardener of (B), characterized in that it further comprises smoked cerium oxide (C). Further, a polyurethane polishing pad obtained by using the composition is provided. |