A pattern forming method includes the step (i) of forming a first film on a substrate by using the first resin composition (I); and using a second resin composition different from the resin composition (I) ( II) a step (ii) of forming a second film on the first film; a step (iii) of exposing the multilayer film having the first film and the second film; and using an organic solvent-containing film The developer develops the first film and the second film in the exposed multilayer film to form a negative pattern (iv).