| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2012-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7df932d6e639aeda44b7731e1b60454d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c13f0b6a158b8df7e1bd5127539830a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8748fa17d04dc5529a6468fa510e59f9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cdd9fb5d38b47dd7d1a320811036d727 |
| publicationDate |
2013-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201321443-A |
| titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using same |
| abstract |
The present invention relates to an epoxy resin composition for semiconductor encapsulation comprising the following components (A) to (F): (A) an epoxy resin; (B) a phenol resin; (C) a curing accelerator; An inorganic filler; (E) a hydrotalcite compound; and (F) a carboxyl group-containing wax having an acid value of from 10 mg KOH/g to 100 mg KOH/g. |
| priorityDate |
2011-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |