| abstract |
A cyanide-based gold plating solution is provided, and in the case of a gold-based plating solution of a cyanide-based gold, it is possible to treat gold plating having high plating hardness even in a state of heat treatment, and has a good ability to form a bump shape. The present invention is a gold plating solution containing a gold cyanide salt, a mineral acid salt, and a carboxylate salt, characterized in that a ruthenium or osmium compound is added. Next, the cerium concentration is preferably 10 to 100 mg/L in terms of metal. |