| abstract |
The present invention provides a resin composition for electrical and electronic component packaging, which can provide a filling property of an encapsulating agent which maintains a practical level and an adhesive property of an encapsulant and an electric and electronic component, and does not overflow the flame retardant electrical property of the flame retardant. Electronic component package. The present invention provides a resin composition for electrical and electronic parts packaging, which comprises a copolymerized polyester elastomer (X), a brominated epoxy resin (B1), a non-brominated epoxy resin (B2), and a polyolefin resin ( C), and dried to a water content of 0.1% or less, heated to 220 ° C, a pressure of 1 MPa, and a melt viscosity of 5 dPa ‧ s or more and 3000 dPa ‧ s or less when extruded by a die having a pore diameter of 1.0 mm and a thickness of 10 mm; An electric and electronic component package and a method of manufacturing an electric and electronic component package using the composition. |