| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-501
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5435
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5425 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 |
| filingDate |
2012-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_770c7623008749902a8f82a5532ac002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d89053cb11c0a4779e5affea917fec1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbda0078592e94145b891b6d42041a63 |
| publicationDate |
2013-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201318231-A |
| titleOfInvention |
Sealing sheet and optical semiconductor device |
| abstract |
The sealing sheet of the present invention is formed of a sealing resin composition containing a sealing resin and polyoxynene fine particles. The blending ratio of the polyoxynene fine particles is 20 to 50% by mass based on the sealing resin composition. |
| priorityDate |
2011-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |