| abstract |
The invention provides a novel surface treated molybdenum compound powder, and provides low thermal expansion rate and drilling processability in the plane direction. Heat resistance. A prepreg, a laminated board, a metal foil laminated board, a printed circuit board, etc. which are excellent in flame retardance. The surface-treated molybdenum compound powder of the present invention is used as a filler in the case where at least a part of the surface is coated with an inorganic oxide. |