Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0959 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0325 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0273 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-1515 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
filingDate |
2012-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77f020928482599616d8caf16ecd4e94 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da1ac94bd4b2a0f0956ed03d835a39ac |
publicationDate |
2013-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201317284-A |
titleOfInvention |
Photosensitive resin composition, hardened film thereof, and printed wiring board |
abstract |
An object of the present invention is to provide a photosensitive resin composition of a cured product which is excellent in the resistance to electroless gold plating and which is excellent in the filling property to the through-holes and which is caused by the sudden boiling of the through-holes. And a hardened film and a printed wiring board having the hardened film. The solution of the present invention is a photosensitive resin composition comprising a photosensitive resin composition of (A) a photosensitive carboxylic acid resin and (B) a liquid bifunctional epoxy resin, which is characterized by being relative to a total carboxyl group. 100 parts by mass of the acid resin contains 200 parts by mass or more of the (C) aluminum-containing inorganic filler. |
priorityDate |
2011-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |