http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201313966-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2012-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6272965a60456b905b2ec52a7ca1e0d2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4bec350df4e5f3bc8d50366b50648f6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd671b7dcd72d7264e47d042e5bbd5d3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_726d8f6e9cad19924d3d83c36f0d0480 |
| publicationDate | 2013-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201313966-A |
| titleOfInvention | Direct plating method |
| abstract | The present invention relates to a direct plating method in the manufacture of printed circuit boards, integrated circuit (IC) substrates, and the like. The method uses a conductive layer selected from the group consisting of conductive polymers, colloidal precious metals and conductive carbon particles for blind microporous (BMV) filling, and thus avoids the intermediate layer of copper deposited by electroless plating in a continuous manufacturing step and thereby avoids The insufficient shape and adhesion of the copper track formed by etching. |
| priorityDate | 2011-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.