http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201313849-A

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filingDate 2012-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2013-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201313849-A
titleOfInvention Abrasive material and polishing composition
abstract The present invention provides a polishing composition containing an abrasive and water. The abrasive material contains zirconia particles. The grain size of the zirconia particles calculated by the diffraction X-ray intensity of 2θ around 28.0° and the diffraction X-ray intensity around 31.0° measured by the powder X-ray diffraction method are both 330 Å or more. Further, the average primary particle diameter of the zirconia particles is 0.2 μm or more. Alternatively, the average secondary particle diameter of the zirconia particles is 1.0 μm or less, and the average secondary particle diameter of the zirconia particles is divided by the average primary particle diameter of the zirconia particles to be 1.5 or less. The polishing composition is used for the purpose of, for example, grinding a hard and brittle material such as sapphire.
priorityDate 2011-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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