Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fa80eed27901ac84139c7a7109c21e17 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L21-00 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-22 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
filingDate |
2012-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cf11a7e672b7173521c9a72519750d7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c59f8518b94514460dcbaa7d5d07dd59 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_756b28984ff4f74b2ac83d73d61839ad http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89a54bfa00d6cdbbbdee7078d5f91ce2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82ca7bf19224d856526c58169260a968 |
publicationDate |
2013-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201313822-A |
titleOfInvention |
Epoxy resin compound and heat dissipation circuit board using same |
abstract |
The invention discloses an epoxy resin compound and a heat dissipation circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a hardener, and an inorganic filler. The epoxy resin includes a crystalline epoxy resin and an inorganic filler in which the rubber additive is dispersed in the epoxy resin. The epoxy resin is used as an insulating material on a printed circuit board to provide a substrate having high heat dissipation characteristics. |
priorityDate |
2011-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |