| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fa80eed27901ac84139c7a7109c21e17 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0201
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-142
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 |
| filingDate |
2012-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_756b28984ff4f74b2ac83d73d61839ad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c59f8518b94514460dcbaa7d5d07dd59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cf11a7e672b7173521c9a72519750d7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89a54bfa00d6cdbbbdee7078d5f91ce2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82ca7bf19224d856526c58169260a968 |
| publicationDate |
2013-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201311754-A |
| titleOfInvention |
Epoxy resin compound and heat dissipation circuit board using same |
| abstract |
The invention discloses an epoxy resin compound and a heat dissipation circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a hardener, and an inorganic filler. A hardener comprising a hardener formed from an epoxy adduct is added to the crystalline epoxy resin. The epoxy resin is used as an insulating material on a printed circuit board to provide a substrate having high heat dissipation characteristics. |
| priorityDate |
2011-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |