abstract |
The present invention relates to a resin composition for cleaning a mold, comprising at least a melamine resin and an inorganic filler, wherein the inorganic filler has an average particle diameter of 4 to 12 μm, a standard deviation of particle diameters of 10 μm or less, and an average length and width of the particle diameter. The aspect ratio is 1 to 1.3, and the standard deviation of the aspect ratio of the particle diameter is 0.5 or less. |