Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6b822ee046eb6c45d1e3bd9ce9c1782e |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02658 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-513 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-517 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7869 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66969 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02565 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02554 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66742 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-78603 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02502 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02488 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02422 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0242 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316 |
filingDate |
2012-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d0bf63f024929a0f7e925d4edfed33e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf0a77ffc22328298fb7190ebe0dee35 |
publicationDate |
2013-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201306129-A |
titleOfInvention |
Semiconductor device manufacturing method |
abstract |
An object of an embodiment of the present invention is to provide a method of fabricating a semiconductor device in which a content of water and hydrogen in an oxide semiconductor film is reduced, and oxygen for reducing oxygen deficiency is supplied from the base film to the oxide semiconductor In the film. A method of fabricating a semiconductor device according to an embodiment of the present invention includes the steps of: forming a laminated base film; performing a first heat treatment; forming an oxide semiconductor film on the laminated base film; and performing a second heating deal with. In the laminated base film, a first base film and an second base film are sequentially laminated, the first base film being an insulating oxide film that releases oxygen by heat treatment, in the second base film The diffusion coefficient of oxygen is smaller than the diffusion coefficient of oxygen in the first base film. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10468514-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9755061-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I582994-B |
priorityDate |
2011-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |