| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2012-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56adf0a20fc8de7a6658afb10750e25f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2537a425aaa7488c35f27c69fcc122c4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a98dc29eb543e5fb59f3c76d0228f184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0fa661bde2f4104b58186a231f4cece
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8637741fdf1d07fa1d149e666c5ea58e |
| publicationDate |
2013-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201305235-A |
| titleOfInvention |
Epoxy resin composition for electronic component packaging and electronic component device using same |
| abstract |
The present invention relates to an epoxy resin composition for electronic component encapsulation comprising the following components (A) to (D): (A) an epoxy resin; (B) a curing agent: comprising the structural unit (1) shown below and The allylated phenol resin of the structural unit (2) is shown below, wherein the structural unit (1) is a molar ratio of the total amount of the structural unit (1) and the structural unit (2) [structural unit (1)/ [Structural unit (1) + structural unit (2)] × 100] is 40 to 100%; (C) a curing accelerator; and (D) an inorganic filler in which allylated phenol as component (B) The resin has a glass transition temperature of -5 ° C to 70 ° C as determined by differential scanning calorimetry (DSC): □ □ |
| priorityDate |
2011-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |