abstract |
The epoxy resin compound has an epoxy resin, a hardener, and an inorganic filler as a main component. The epoxy resin includes an epoxy resin of a chemical equation. Therefore, since the crystallization is favored by having an epoxy resin including a mesogenic structure, the heat transfer coefficient of the epoxy resin compound is increased. Further, a high-radiation heat sink using the above epoxy resin as an insulating material can be used for a printed circuit board. |