http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201300951-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1092 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F20-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P1-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 |
| filingDate | 2012-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf2155c496ae02c5aae5b76aba16d4ef http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_874eab723f48dd1f2778e806aaa32e36 |
| publicationDate | 2013-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201300951-A |
| titleOfInvention | Photosensitive resin composition, photosensitive film, pattern forming method, method for forming hollow structure, and electronic component |
| abstract | The present invention is a photosensitive composition comprising (A) a photopolymerizable compound having at least one ethylenically unsaturated group and (B) an oxime ester compound and/or a phosphinylphosphine compound as a photopolymerization initiator. A resin composition or a thermal radical generator containing (A) a photopolymerizable compound having at least one ethylenically unsaturated group, (B) a photopolymerization initiator, and (C) as a thermal polymerization initiator A photosensitive resin composition. The photosensitive resin composition of the present invention is excellent in moist heat resistance, has a high elastic modulus at a high temperature, and is excellent in hollow structure retention, and is suitable for forming an edge of the hollow structure in an electronic component having a hollow structure. The material forming part and/or the cover part. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110775936-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110775936-A |
| priorityDate | 2011-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 222.