http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201300453-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_77387b1b9bc023eec7f13d42ecd85ea9 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41M1-10 |
| filingDate | 2011-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37c0fa856a2a00c4c7da4f5923db34f1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c280bc467c4b6b8ebfbae9a5514d0d0 |
| publicationDate | 2013-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201300453-A |
| titleOfInvention | Thermosensitive composition and its use |
| abstract | The present invention is directed to a heat sensitive composition comprising: (a) a phenolic resin; (b) a dissolution inhibitor; (c) an infrared radiation absorbing compound; and (d) a solvent resistant additive. The heat-sensitive composition of the invention can be used in thermal lithography, has good solvent resistance, can improve the processing speed and improve the printing yield of the printing plate, and exhibits excellent developability and alkali resistance. |
| priorityDate | 2011-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 93.