http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201250950-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-686 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-226 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2012-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c37617a935280e521bc8a0e2185ad8c |
| publicationDate | 2012-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201250950-A |
| titleOfInvention | A semiconductor module component and a liquid sealing resin composition |
| abstract | The present invention provides a thinner semiconductor module component sealed with liquid sealing resin composition, which is suppressed in thermal warping. The semiconductor module component of the present invention is equipped with the semiconductor chip and / or a passive element to the circuit board for the module that consists of a core substrate including a core material, and is sealed with a resin composition which comprises (A) an epoxy resin, (B) an inorganic filler, (C) a curing accelerator and (D) a silane compound having a secondary amino group or a tertiary amino group, as essential components. The modulus of elasticity at 250 DEG C of the cured product of the composition is 1 to 15 GPa, the coefficient of thermal expansion from 25 DEG C to 260 DEG C is 2500 to 4500 ppm, and the height of the semiconductor module component is 1.6 mm or less. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10615093-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I672773-B |
| priorityDate | 2011-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 67.