abstract |
Provided is a method for manufacturing an Sn alloy bump, wherein composition of the Sn alloy bump can be easily controlled. The method for manufacturing an Sn alloy bump formed of an alloy composed of Sn and other one or more kinds of metals has: a step wherein an Sn layer (4a) is formed by electrolytic plating on an electrode pad (3) in a resist opening (2a), said electrode pad being formed on a substrate (1); a step wherein Sn and an alloy layer (4b) are laminated on the Sn layer (4a) by electrolytic plating; and a step wherein an Sn alloy bump (5) is formed by melting the Sn layer (4a) and the laminated alloy layer (4b) after removing a resist (2). |