| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_81bbed339049c84138a09736b647d40e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2011-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2040dd2671348e137a7cb83b2097bec0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc911cc3a3a89ff4623b031c9fed4635
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_294f0b89a2490006f54a03db59102815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17ab3d215d406ff3c6e345e843f17b4f |
| publicationDate |
2012-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201250871-A |
| titleOfInvention |
Semiconductor package with nonconductive layer and manufacturing method thereof |
| abstract |
A semiconductor package with nonconductive layer and a manufacturing method thereof are disclosed. The manufacturing method comprises the following steps. First, a substrate is provided. The substrate comprises several chips. Then, several conductive pillars are formed adjacent to an active surface of the chips. Then, a nonconductive layer is formed to entirely encapsulate the conductive pillars. Then, a substrate is singulated. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I773810-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I777232-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11424216-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I644409-B |
| priorityDate |
2011-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |