http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201248742-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af1aac0717028a45913e80d9e05fad8 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-054 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16151 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 |
| filingDate | 2011-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddb0ddb58b863297515959955169cb0a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c21145a1cb783511c989c14a28b664f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_889e5c3c0dcc749148220193dcee4f7c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_079ec320f1f76906993c7666137e2cc4 |
| publicationDate | 2012-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201248742-A |
| titleOfInvention | Package structure having micromechanical element and method of making same |
| abstract | The invention provides a package structure having micromechanical elements formed thereon, including a wafer, a board body, transparent bodies, a packaging layer, solder wires and metallic conductive traces. The wafer comprises a plurality of micromechanical elements, electrical connecting points and second alignment keys; the board body is covered on the micromechanical elements and airtight packaged; each of the transparent bodies are disposed with respect to a respective second alignment key; the packaging layer is disposed over the wafer encapsulating the board bodies, the electrical connecting points and the transparent bodies therein; the solder wires are embedded in the packaging layer, one end of each solder wire being connected to a respective electrical connecting point while the other end thereof being exposed from the top surface of the packaging layer, the metallic traces are disposed on the packaging layer and electrically connected to electrical connecting wires via solder wires. The invention does not require that through holes be formed on silicon substrates so as to reduce the costs for production and also for equipment since only a common alignment device is employed to accomplish the wiring process. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104716119-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104716119-B |
| priorityDate | 2011-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.