| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2b86357fa6e8b130b3e17c7f8e56856f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-42 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D409-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D409-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D235-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-149
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D233-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D233-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-365
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-52 |
| filingDate |
2012-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_739389efe59eefb9f4ee5a531c95c2ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ed7634ca112788a617d226b955cbf78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91a4c263c076369d6cafffc97f4f91ff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cb28c214379bf11d0e43067e1f1a755 |
| publicationDate |
2012-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201247935-A |
| titleOfInvention |
Surface treating composition for copper and copper alloy and utilization thereof |
| abstract |
A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed. |
| priorityDate |
2011-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |