| abstract |
In a connecting structure which is used in situations of electronic component mounting and via hole connection, where a first article being connected and a second article being connected are connected using solder, the present invention increases the joining reliability after thermal shock. When the cross-section of a connection part (4) is analyzed by WDX, a region (9) where at least Cu-Sn based, M-Sn based (M being Ni and/or Mn), and Cu-M-Sn based intermetallic compounds are present is formed in the cross-section of that connection part (4). In addition, when the cross-section of the connection part (4) is segmented uniformly so that there are 10 units per row and column for a total of 100 units, the proportion of the number of units where at least two or more intermetallic compounds of different constituent elements are present is set to 70% or greater of the total number of units excluding those where only the Sn metal component is present in a unit. |