| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-04 |
| filingDate |
2011-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afee2551a3c7150556fd318894579d56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8748fa17d04dc5529a6468fa510e59f9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7df932d6e639aeda44b7731e1b60454d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c13f0b6a158b8df7e1bd5127539830a |
| publicationDate |
2012-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201245322-A |
| titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained using the same |
| abstract |
The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (E): (A) an epoxy resin; (B) a phenol resin other than the following component (C); (C) a silane-modified phenol resin represented by Formula (1) in which R1 to R4 may be the same or different from each other and are each independently a hydrogen atom or a monovalent functional group represented by Formula (a), provided that at least two of R1 to R4 are hydrogen atoms and at least one of the others is the functional group represented by Formula (a) in which R5 is an alkoxyl group, R6 is an alkoxyl or alkyl group, R7 is an alkyl group, and n is an integer of from 1 to 50; (D) a curing accelerator; and (E) an inorganic filler, in which the component (C) is contained in an amount of 0.8 to 30.0% by weight based on a total weight of organic components in the epoxy resin composition: |
| priorityDate |
2010-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |