| abstract |
This invention provides a cover film, which at least includes: a substrate layer (A), an intermediate layer (B), a peeling layer (C), and a heat-seal layer (D); wherein the peeling layer (C) includes a polystyrene based resin composition (a) and an ethylene-alpha-olefin random copolymer (b), and the content of (b) component in the peeling layer is 20 to 50 percent by mass, and includes a resin composition with a Vicat softening temperature in a range of 55 to 80 degrees Celcius; the heat-seal layer (D) includes an acrylic based resin with a glass transition temperature in a range of 55 to 80 degrees Celcius. By means of this cover film, it is possible to heat seal toward the carrier tape such as polystyrene and so on with sufficient peeling strength even in a short time, and because the changes of the peeling strength is small, flying out of the parts could be avoided. |