| abstract |
A fabricating method of a light emitting semiconductor component is given, in which a light emitting semiconductor chip (2) is arranged on a mounting face (10) of a carrier (1), the semiconductor chip (2) is electrically connected to electrical contact-areas (11, 12) on the mounting face (10) and a capsulation layer (3) is applied on the semiconductor chip (2) by means of atom layer deposition, wherein all free surfaces of the semiconductor chip (2) are covered, after the mounting and electrical connection, with a capsulation layer (3). In addition, a light emitting semiconductor component is given. |