Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b2d32a1324eb3a240649ffee8d475d63 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28202 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02332 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78 |
filingDate |
2011-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5720112c3192d045a3bba428926c28a6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37660544ea1c79c0f38175e0fd59f9c9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb0fba44a4653e254027e222c54b1355 |
publicationDate |
2012-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201243918-A |
titleOfInvention |
Methods for fabricating a gate dielectric layer and for fabricating a gate structure |
abstract |
A method for fabricating a gate dielectric layer comprises the steps of: forming a dielectric layer on a semiconductor substrate; performing a nitrogen treating process to form a nitride layer on the dielectric layer; and performing a thermal treating process at 1150-1400 DEG C for a period of 400-800 milliseconds, to form a gate dielectric layer. A step of forming a gate layer on the gate dielectric layer may be performed to form a gate structure. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I704620-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10985022-B2 |
priorityDate |
2011-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |