http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201241581-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C59-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-3842
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y40-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y10-00
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30
filingDate 2012-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f7d5aab24af19ca2864d52d45c19f49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_070b6f30b4bba2d78094a2ea0bf015ae
publicationDate 2012-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201241581-A
titleOfInvention Method for forming resist patterns and method for producing patterned substrates employing the resist patterns
abstract To enable the widths of protrusions of a resist pattern after residual film etching steps to be a desired value greater than or equal to the widths of the protrusions of the resist pattern prior to the residual film etching steps. Residual film etching steps for etching a resist film (2) onto which a pattern (13) of protrusions and recesses (13) has been formed includes: a first etching step that employs a first etching gas including a sedimentary gas that generates sediment (4) during etching to etch the resist film under conditions such that the sediment (4) is deposited on the side walls (2a) of protrusions of a resist pattern while residual film (2b) is etched. The conditions are set such that steps following the first etching step etch the resist film (2) such that the widths of the protrusions (2a) including the deposited sediment (4) become a desired width greater than or equal to the widths of the protrusions (2a) prior to the residual film etching steps.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9332646-B2
priorityDate 2011-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID4030
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID421035466
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23976
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID81766
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID11638
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID75617
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID411556313
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419527018
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID408653331
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458391465
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID977
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419523291
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419581175

Total number of triples: 32.