http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201241362-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_facde2b630a6b3a51a1a6f6657840462 |
classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21Y101-02 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21V29-505 |
filingDate | 2011-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c39a02e765aab6a203f95ff46d9fe0d4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6fafbf6fa916dbd0ae7de1f7766f8cc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4d1590119f59270963ae41909aa58b6 |
publicationDate | 2012-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-201241362-A |
titleOfInvention | A structure of light emitting diode heat sink module |
abstract | There is provided a pattern on the structure of light emitting diode heat sink module, including: heat sink cover, thermo-conductivity sheet, thermo-conductivity holder, and radiation fin pieces components. Because the component interfaces has very close contact to each other heat can be removed and transferred from light emitting diode to thermo-conductivity holder and radiation fin pieces, quickly. And, the radiation fin pieces were set on the thermo-conductivity holder through one-step punch process. The purpose of this pattern is getting the Light Emitting Diode Heat Sink Module without heat conduction paste using. |
priorityDate | 2011-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.