| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eece3f4c4266dfce4fc469ddcb3eb4e9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5419 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-14 |
| filingDate |
2012-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff5e0ba01731bd55987ee2c2243c3f59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff5d657f73988cc5d6b59fec7e654371
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c119b0c662d691e3f63a1a04167b31cf |
| publicationDate |
2012-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201241092-A |
| titleOfInvention |
Heat-curable silicone resin composition for sealing optical semiconductor, and a sealed package of optical semiconductor using the same |
| abstract |
The present invention provides: a heat-curable silicone resin composition for optical-semiconductor encapsulation which comprises (A) 100 parts by weight of an organopolysiloxane resin, (B) 10-500 parts by weight of an alkoxysilane oligomer having silicon-bonded alkoxy groups in an amount of 5-50 wt.%, (C) 10-200 parts by weight of a diorganopolysiloxane in which both ends of the molecular chain each have been blocked with a silanol group and/or an alkoxysiloxy group and which has a viscosity at 25 C of 5-10,000 mPas, and (D) a zinc compound; and an optical-semiconductor package formed using the composition. This composition becomes a cured object which has excellent long-term reliability at high temperatures and which has an adequate hardness. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I664748-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107075255-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107075255-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106256854-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I490276-B |
| priorityDate |
2011-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |