Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4880e2a99a48a9c481e535386ca88b97 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8592 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-46 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-46 |
filingDate |
2011-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a297133fa635e3ce175e8f5c65100fb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1d178a146ab0f8b74ce981ba035c011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_952e9a45e170691f17f3dc1eab75e590 |
publicationDate |
2012-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201238085-A |
titleOfInvention |
Light emitting diode package structure |
abstract |
The invention provides a light emitting device package structure, includes a substrate; a LED chip formed on the substrate; a composite coating layer formed on the LED chip, wherein the composite coating layer comprises a first coating layer and a second coating layer and has reflectivity greater than 95 % at the wavelength of 500-800 nm; a cup body formed on the substrate, wherein the cup body surrounds the LED chip; a encapsulation housing covering the LED chip, wherein the encapsulation housing comprises a wavelength transformation material. |
priorityDate |
2011-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |