http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201238085-A

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filingDate 2011-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a297133fa635e3ce175e8f5c65100fb
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publicationDate 2012-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201238085-A
titleOfInvention Light emitting diode package structure
abstract The invention provides a light emitting device package structure, includes a substrate; a LED chip formed on the substrate; a composite coating layer formed on the LED chip, wherein the composite coating layer comprises a first coating layer and a second coating layer and has reflectivity greater than 95 % at the wavelength of 500-800 nm; a cup body formed on the substrate, wherein the cup body surrounds the LED chip; a encapsulation housing covering the LED chip, wherein the encapsulation housing comprises a wavelength transformation material.
priorityDate 2011-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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