http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201236194-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9884b2360f2413d7edea0d5af39f775a |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-44 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-405 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-10 |
| filingDate | 2012-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3184840a1b400bf7a4140d9ffa3fd103 |
| publicationDate | 2012-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201236194-A |
| titleOfInvention | Opto-electronic semiconductor chip |
| abstract | An optoelectronic semiconductor chip (1) is provided, including: an electrical isolating carrier substrate (11), a semiconductor layer sequence (2), a mirror layer (6) arranged between the carrier substrate (11) and the semiconductor layer sequence (2), an electrical isolating transparent capsule layer (10), which covers side edges (16) of the mirror layer (6) and side edges (21) of the semiconductor layer sequence (2), a first bond pad (19) and a second bond pad (9), which are arranged, respectively laterally offset from the semiconductor layer sequence (2), on a side, facing a radiation emitting face (15) viewed from the carrier substrate (11), of the optoelectronic semiconductor chip (1), a contact layer (7), which is arranged at least on partial areas of the radiation emitting face (15), and an electrical connection layer (8), which conductively connects the second bond pad (9) with the contact layer (7), and extends on the transparent capsule layer (10) over the side edges (21) of the semiconductor layer sequence (2) to the second bond pad (9). |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10418535-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I589029-B |
| priorityDate | 2011-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.