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publicationDate 2012-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201235455-A
titleOfInvention CMP slurry and method for manufacturing the same, method for manufacturing composite particle and method for polishing substrate
abstract A CMP slurry of the invention includes water and polishing particles with composite particles. The composite particle has a core containing a first particle and a second particle disposed on the core. The first particle contains silicon dioxide, and the second particle contains cerous hydroxide. The pH value of the CMP slurry is not more than 9.5.
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