| abstract |
Provided is a resin composition for expansion molding, which can achieve a high expansion ratio and enables the production of an expansion-molded article having greatly improved touch and greatly improved vibration-damping properties. The present invention is a resin composition for expansion molding, comprising: thermally expansive microcapsules each of which comprises a shell comprising an epoxy resin and a volatile expansion agent encapsulated in the shell as a core agent; a thermoplastic resin; and a curable compound which has, in the molecule thereon, at least two of at least one kind of functional groups selected from the group consisting of a carboxyl group, a hydroxy group, an amino group, an amide group and an acid anhydride group. |