| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D11-024 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18 |
| filingDate |
2011-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2406cca20e71e5dfca142b9e990e05b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5e9575084dab9bb13e8a22271ed22fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fedb24e259e791ec5fb0a661ab4ca1c |
| publicationDate |
2012-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201231738-A |
| titleOfInvention |
Electroplating method |
| abstract |
A substrate with a through-hole defined therein is immersed in a plating solution in a plating tank. A pair of anodes are disposed in the plating solution in the plating tank in facing relation to face and reverse sides, respectively, of the substrate in the plating solution. A plurality of plating processes are performed, each for a predetermined period, on the face and reverse sides of the substrate by supplying pulsed currents respectively between the face side of the substrate and one of the anodes which faces the face side of the substrate, and between the reverse side of the substrate and the other of the anodes which faces the reverse side of the substrate. A reverse electrolyzing process is performed on the face and reverse sides of the substrate between adjacent ones of the plating processes by supplying currents in an opposite direction to the pulsed currents in the plating processes respectively between the face side of the substrate and one of the anodes which faces the face side of the substrate, and between the reverse side of the substrate and the other of the anodes which faces the reverse side of the substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I698556-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107109677-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108396360-A |
| priorityDate |
2010-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |