http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201230066-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5c6a9fd6219b32cd3893a49979951bf4 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 |
| filingDate | 2011-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a0cf4f8fd89a6f485c52c30e054f1bd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f185d3570ddac15283cbb17907fc8965 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fe063499fca366bb333322e4ea9e227 |
| publicationDate | 2012-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201230066-A |
| titleOfInvention | Low-temperature sintering conductive paste, conductive film using same, and method for forming conductive film |
| abstract | When using a substrate having a low resistance to heat, it is preferred that heat treatment is performed at approximately 120 DEG C which is a temperature in which the substrate does not become deformed. Moreover, if it is possible to achieve a low resistance regardless of the type of the resin used for the conductive paste, it will be possible to design a paste for different purposes, and the fields to which the paste could be applied will increase. Thus, provided is a conductive paste capable of forming a conductive film exhibiting a high conductivity even at a low temperature of approximately 120 DEG C regardless of whether the constituting resin is a thermosetting resin or a thermoplastic resin. A method for forming a conductive film, wherein a conductive paste in which a C2-8 dicarboxylic acid is added to a paste comprising a resin, a dispersion medium, and silver nanoparticles covered with a C2-6 organic substance is used as the metallization paste. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104968746-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I690946-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104968746-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I571889-B |
| priorityDate | 2010-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 128.