| abstract |
An epoxy resin composition that exhibits excellent fluidity, hardens well, exhibits excellent flame retardancy for a non-halogen resin, and is useful as a semiconductor sealant, molding material, lamination material, powder coating, adhesive material, or the like. The epoxy resin component of said epoxy resin composition contains an epoxy resin represented by general formula (1) and a bifunctional crystalline epoxy resin having a melt viscosity of 0.001-0.05 Pas at 150 DEG C, with the weight of the epoxy resin represented by general formula (1) being at least 30% of that of the entire epoxy resin. In general formula (1), G represents a glycidyl group, R1 and R3 represent hydrogen or hydrocarbon groups, R2 represents a substituent represented by formula (a), n represents 1 to 20, and p represents 0.1 to 2.5. |