Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0046 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0397 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-325 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-32 |
filingDate |
2011-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9163d5763457518986267c7f5364aae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9473e6941c583ff6ee73ad721e18287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be87c92604b31e2c1293df1cc6962f9c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dcb2c4837169cb5346fc2ab4884a4187 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d784f46c5f35aad97341009ba5dad33 |
publicationDate |
2012-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201229067-A |
titleOfInvention |
Pattern forming method and radiation-sensitive resin composition |
abstract |
The purpose of the present invention is to provide a pattern forming method that has excellent lithographic properties such as CDU, and can suppress roughness in the surface of an exposed section after development, and a radiation-sensitive resin composition optimal for the pattern forming method. The present invention is a pattern forming method containing (1) a step for forming a resist film on a substrate using a radiation-sensitive resin composition, (2) an exposure step, and (3) a development step, the pattern forming method being characterized in that an organic solvent constitutes 80 mass% of the developing fluid in the development step, and in that the radiation-sensitive resin composition contains (A) a polymer in which a structural unit (I) represented by formula (1) constitutes 45-80 mol% thereof, and (B) a radiation-sensitive acid generator. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I603146-B |
priorityDate |
2010-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |