http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201228025-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-20
filingDate 2010-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d72ead64aeb300270a22fbbfa0da854
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publicationDate 2012-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201228025-A
titleOfInvention Method for manufacturing light emitting chip
abstract A method for manufacturing a light emitting chip, includes steps: providing a substrate having a first blocking layer which divides a top face of the substrate to multiple growing areas; growing a first semiconductor layer in the areas to spread on the first blocking layer; forming a second blocking layer partially covering the first blocking layer; growing a light emitting structure on the first semiconductor layer to spread on the second blocking layer; removing the first and second blocking layers to define gaps between the light emitting layer, the first semiconductor layer and the substrate; etching the first semiconductor layer and the light emitting structure so that the first semiconductor layer and the light emitting structure have tapered shapes which has wide tops and narrow bottoms. The method can be applied in low temperature to ensure reliability of the manufacturing process.
priorityDate 2010-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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