| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aafe0172ffd94d3486c518b0709bb2b3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01012 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate |
2011-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49cd04f4407eed140b493cdb6a2799c6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85c4967299aec470e74a3d14128aa65c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_810e94bc65470e8c67521456466d8b05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4026c5cc1c0ed4ba2fac6086564617a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2caa88541fcb971a2a6ec789c9e4cb9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab39a3e5e998595192d26548cf4a3450 |
| publicationDate |
2012-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201226517-A |
| titleOfInvention |
Dicing die bonding film, composition for dicing die bonding film and semiconductor device |
| abstract |
The present invention discloses a dicing die bonding film, a composition for a dicing die bonding film and a semiconductor device, and the dicing bonding film includes a first surface (A) adjoining a base film and a second surface (B) adjoining a semiconductor wafer, wherein the second surface has higher peel strength than the first surface and has a peel strength of 0.2N/25mm or more. The dicing die bonding film is separated smoothly from the surface to the base film but is not separated from the surface to the wafer, thereby exhibiting excellent pick-up properties. |
| priorityDate |
2010-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |