http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201226486-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e4c608a8531ea588aab7e23318e09a77 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate | 2010-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01692dd965dd9c8a2daa1ced3724faec http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0dc1dcd0bcfafc27338ee5ac60c958d2 |
| publicationDate | 2012-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201226486-A |
| titleOfInvention | Chemical mechanical polishing fluid |
| abstract | The present invention discloses a chemical mechanical polishing fluid, which contains grinding granules, an oxidation agent, a polyhydroxyl compound, an organic base, and water. The chemical mechanical polishing fluid of the present invention prominently raises the polishing speed of copper under the alkaline condition, so that the polishing speeds of silicon and copper under the alkaline polishing condition are simultaneously and prominently raised. |
| priorityDate | 2010-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.