http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201225771-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0b39b5e20e9d581a0dc8e0b4c790e9bf
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
filingDate 2010-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_803c9d8fbfb540890cd4c23ac2ab53f1
publicationDate 2012-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201225771-A
titleOfInvention Printed circuit board and method for manufacturing the same
abstract This disclosure relates to a printed circuit board. The printed circuit board includes a base board, a circuit layer, a protective layer, and a fluorinated carbon film. The base board has a first surface, and the circuit layer is formed on the first surface. The circuit layer includes a number of electrically conductive circuits and a number of electrically conductive contacts. The protective layer has a first protective surface adjacent to the base board and a second protective surface opposite to the first protective surface. A number of through holes are formed in the protective layer to expose the contacts. The fluorinated carbon film is deposited on the second protective surface and the surface of the contacts exposed in the through holes. The fluorinated carbon film consists of carbon and fluorine, and the ratio of the number of the fluorine atoms to the number of the carbon atoms is in the range of 1.2 to 1.5. A method for manufacturing the above-mentioned printed circuit board is also provided.
priorityDate 2010-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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