| abstract |
Provided is a process for producing a compatibilized resin which comprises reacting a cyanate compound, a siloxane resin having a hydroxy group at an end, and an epoxy resin to a specific conversion. Also provided is a thermosetting resin composition which comprises: a compatibilized resin (A1) produced by the process or a thermosetting resin (A2) obtained by reacting a cyanate compound with a siloxane resin having a hydroxy group at an end to a specific conversion; and fused silica (B) in which the surface has been treated with a trimethoxysilane compound. Furthermore provided are a prepreg, a laminate, and a wiring board each obtained using the resin composition. The thermosetting resin composition is excellent in terms of all of low thermal expansion, adhesiveness to copper foils, heat resistance, flame retardancy, copper-clad heat resistance (T-300), dielectric properties, and drillability. With the composition, increases in the density of wiring boards and high reliability thereof, which are required at present, are attained. The composition can be widely used for producing electronic appliances, etc. |